Job Description

Job Description – SoC Architect (Chiplet-Based Systems)
Company

Mulya Technologies

Position

SoC Architect – Chiplet-Based Systems

Location
Bangalore / Remote (Anywhere in India)
Employment Type
Full-Time
Role Overview

Mulya Technologies is seeking a highly experienced SoC Architect to lead the architecture and integration of next-generation chiplet-based AI systems.

This role focuses on defining modular compute platforms using advanced chiplet integration technologies. The selected candidate will architect high-bandwidth memory and I/O connectivity between chiplets, define scalable die-to-die communication protocols, and optimize subsystem interactions for future AI accelerator platforms.

The role requires close collaboration with packaging, PHY, interconnect, verification, and silicon bring-up teams to deliver high-performance, low-latency, and power-efficient multi-die systems.

Key Responsibilities
SoC & Chiplet Architecture
Define SoC architecture for chiplet-based AI inference platforms.
Architect:
Inter-chiplet communication
Data paths
Synchronization strategies
Scalable interconnect protocols
Drive partitioning decisions across:
Compute chiplets
Memory chiplets
I/O chiplets
Control chiplets
High-Speed Interconnect & Interfaces
Define and optimize die-to-die interfaces such as:
UCIe
BoW
Custom interconnect links
Specify interconnect requirements including:
Bandwidth
Latency
Power efficiency
Collaborate closely with:
Packaging teams
PHY engineers
Interconnect architects
PCIe, Memory & Subsystem Design
Architect PCIe and DMA interfaces for host connectivity.
Design scalable memory hierarchies using:
LPDDR4/LPDDR5
HBM
Own subsystem architecture involving:
PCIe Gen4/Gen5
RISC-V clusters
High-performance memory systems
Integration & Verification
Integrate and verify third-party IPs for:
I/O
Memory
Inter-chip communication
Support:
System bring-up
Debugging
Validation of multi-chip systems
Ensure coherent and low-latency communication across chiplet domains.
Required Qualifications
BS/MS/PhD in:
Electrical Engineering
Computer Science
Related field
10–25+ years of experience in:
SoC architecture
Multi-die systems
High-performance semiconductor platforms
Required Technical Skills
Chiplet & Packaging Expertise
Hands-on experience with chiplet-based architectures.
Familiarity with:
UCIe
EMIB
Foveros
Similar advanced packaging technologies
Architecture & System Design
Strong understanding of:
Modular SoC partitioning
Die-to-die interconnect architectures
High-performance AI compute systems
High-Speed Interfaces & Memory
Experience with:
PCIe Gen4/Gen5
RISC-V subsystems
LPDDR4/5
HBM memory interfaces
Verification & Debug
Familiarity with:
Chiplet-aware bring-up methodologies
System-level verification strategies
Multi-chip debug environments
Strong experience in:
SystemVerilog
UVM
System-level test/debug flows
Preferred Skills
Experience with AI accelerator architectures.
Knowledge of scalable HPC and distributed compute systems.
Understanding of low-power optimization techniques.
Strong cross-functional collaboration and leadership skills.
Why Join Mulya Technologies?
Opportunity to architect cutting-edge AI chiplet platforms.
Work on advanced semiconductor packaging and interconnect technologies.
Flexible remote working options across India.
Exposure to next-generation high-performance compute architectures.