SoC Architect

Job Description

Job Description – SoC Architect (Chiplet-Based Systems)
Company

Mulya Technologies

Position

SoC Architect – Chiplet-Based Systems

Location
Bangalore / Remote (Anywhere in India)
Employment Type
Full-Time
Role Overview

Mulya Technologies is looking for an experienced SoC Architect to lead the architecture and design of next-generation chiplet-based AI systems. The role focuses on defining scalable modular compute platforms utilizing advanced chiplet integration technologies for AI accelerator solutions.

The ideal candidate will architect high-bandwidth memory and I/O connectivity between chiplets, define scalable die-to-die protocols, and optimize system-level communication for performance, latency, and power efficiency.

This role involves close collaboration with packaging, PHY, interconnect, and verification teams to drive successful multi-die system integration.

Key Responsibilities
SoC & Chiplet Architecture
Define the SoC architecture for chiplet-based AI inference platforms.
Design inter-chiplet data paths, synchronization mechanisms, and scalable communication protocols.
Drive partitioning strategies across:
Compute chiplets
Memory chiplets
I/O chiplets
Control chiplets
Interconnect & Interface Design
Architect PCIe and DMA interfaces for host communication and chiplet-domain integration.
Define die-to-die interconnect requirements including:
Bandwidth
Latency
Power optimization
Work with advanced die-to-die interfaces such as:
UCIe
BoW
Custom interconnect links
Integration & Verification
Collaborate with packaging and PHY teams on multi-die integration strategies.
Integrate and verify third-party IPs related to:
Memory
I/O
Inter-chip communication
Support system bring-up, debugging, and validation of multi-chip systems.
Memory & Subsystem Ownership
Own subsystem architecture involving:
PCIe Gen4/Gen5
RISC-V clusters
LPDDR4/LPDDR5
HBM memory hierarchies
Ensure coherent, low-latency, and power-efficient communication across chiplets.
Required Qualifications
BS/MS/PhD in:
Electrical Engineering
Computer Science
Related field
10–25+ years of experience in:
SoC architecture
Multi-die systems
Chiplet-based designs
Required Technical Skills
Chiplet & Packaging Expertise
Hands-on experience with chiplet-based systems.
Familiarity with packaging/interconnect technologies such as:
UCIe
EMIB
Foveros
Architecture & Design
Strong understanding of:
Modular SoC partitioning
Die-to-die interconnect architectures
High-performance AI compute systems
Subsystem Experience
Experience with:
PCIe Gen4/Gen5
RISC-V subsystems
LPDDR4/5
HBM memory interfaces
Verification & Debug
Familiarity with:
Chiplet-aware bring-up methodologies
System-level verification
Multi-chip debugging
Hands-on experience in:
SystemVerilog
UVM
System-level test/debug strategies
Preferred Skills
Experience working on AI accelerator platforms.
Knowledge of scalable high-performance computing architectures.
Understanding of low-power and high-bandwidth system optimization techniques.
Strong cross-functional collaboration and problem-solving abilities.
Why Join Mulya Technologies?
Opportunity to work on cutting-edge AI and chiplet technologies.
Exposure to advanced semiconductor packaging ecosystems.
Flexible remote working options across India.
Opportunity to contribute to next-generation AI accelerator platforms.